Research Summary
Research interests lie primarily in the areas of design and advanced manufacturing with focus on improvement and efficiency. I have had the opportunity to investigate the application of design for the environment and green manufacturing to lead-free soldering technologies in electronics production.In the News
Research Keywords
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Recent Publications
Regulations and market trends in lead-free and halogen-free electronics
Nie, L., Pecht, M. & Ciocci, R., May 22 2007, In: Circuit World. 33, 2, p. 4-9 6 p.Research output: Contribution to journal › Article › peer-review
Impact of environmental regulations on green electronics manufacture
Ciocci, R. & Pecht, M., 2006, In: Microelectronics International. 23, 2, p. 45-50 6 p.Research output: Contribution to journal › Review article › peer-review
Learning from the migration to lead-free solder
Ciocci, R. & Pecht, M., 2006, In: Soldering and Surface Mount Technology. 18, 3, p. 14-18 5 p.Research output: Contribution to journal › Article › peer-review
Teaching sustainable engineering ten years later: What's worked & what's next?
Ciocci, R., 2006, In: ASEE Annual Conference and Exposition, Conference Proceedings.Research output: Contribution to journal › Conference article › peer-review
Previews of coming attractions - Employing the first year seminar to prepare engineering freshmen for success in college and beyond
Cottrell, D., Ciocci, R. C. & Shoup, J., Jan 1 2006, In: ASEE Annual Conference and Exposition, Conference Proceedings.Research output: Contribution to journal › Conference article › peer-review
American Society of Mechanical Engineers, Technology and Society Division (Publication) TS: Introduction
Marquez, T., Ciocci, R., Gardner, T., Jablokow, K., Kennedy, R., Kreith, F., Lausten, C., Lesikar, J., Sessions, J., Talreja, R. & Westbrook, D., 2006, In: American Society of Mechanical Engineers, Technology and Society Division (Publication) TS.Research output: Contribution to journal › Editorial › peer-review
Questions concerning the migration to lead-free solder
Ciocci, R. & Pecht, M., Feb 16 2004, In: Circuit World. 30, 2, p. 34-40+6+8Research output: Contribution to journal › Review article › peer-review
Engineering and engineering technology program assessments - DACUM style
Ciocci, R., 2003, In: ASEE Annual Conference Proceedings. p. 6527-6533 7 p.Research output: Contribution to journal › Conference article › peer-review
Assessment of an engineering and technology summer program for underrepresented students
Ciocci, R., 2001, In: ASEE Annual Conference Proceedings. p. 2263-2269 7 p.Research output: Contribution to journal › Conference article › peer-review
Handling the migration to lead free
Ciocci, R. C., Sep 2001, In: IEEE Transactions on Components and Packaging Technologies. 24, 3, p. 536-538 3 p.Research output: Contribution to journal › Article › peer-review
Lead-free solder replacement: Beyond the material substitution
Ciocci, R., 2001, In: Proceedings of SPIE - The International Society for Optical Engineering. 4569, p. 100-108 9 p.Research output: Contribution to journal › Conference article › peer-review
Applied algebra with laboratory experimentation
Ciocci, R. C., Godbois, C. & Leung, E., 1998, In: ASEE Annual Conference Proceedings.Research output: Contribution to journal › Article › peer-review
Product reuse and reliability
Ciocci, R., 1996, In: ASEE Annual Conference Proceedings. p. 2623-2628 6 p.Research output: Contribution to journal › Conference article › peer-review